Shenzhen Shengxu Electronics Technology Co.,Ltd. Company Logo Shenzhen Shengxu Electronics Technology Co.,Ltd.
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Fast Supply Electric Circuit Board Assembly Manufacturer

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Shenzhen Shengxu Electronics Technology Co.,Ltd.
[China]

Address
5th Floor, Building F, Hongfa Technology Industrial Park, Tangtou Community, Shiyan Street, Baoan Di Shenzhen Guangdong
Phone
86-0755-82192094
Contact name
Edward

Quick Information

  • Place of Origin: China
  • :

Description

Fast supply electric circuit board assembly  manufacturer

 4 YAMAHA High-speed SMT Lines

 6 million daily SMT placements capability

 400,000 daily DIP placements capability

 500×600 mm Maximum Board Size

 0.25"x 0.25" Minimum Board Size

 450 mm Max. Width for Wave-Solder

 Passives Components Down to 0201 Size BGA and VFBGA Leadless Chip Carrier/CSP Double-Sided SMT Assembly  Fine Pitch to 08 Mil BGA Repair and ReballPart Removal and Replacement

SMT and DIP/X-RAY Inspection/AOI Testing/In-circuit-test (ICT)/Flying Probe/Function Test/Burn-in/Finished products assembly

What is a DHI board?

High Density Interconnector (HDI), is a circuit board with a relatively high density of line distribution using micro-bumping. The HDI PCB assembly manufacturing  has an inner layer line and an outer layer line, and uses a process such as drilling and metallization in the hole to connect the inside of each layer. HDI boards are generally manufactured by a laminated method. The more times the layers are stacked, the higher technical grade of the board is. The common HDI boards are basically one-time laminated, high-grade HDI uses two or more layers of technology. Meanwhile it adopts advanced PCB technology such as stacking holes, plating holes, and laser direct drilling to finish.

PCB board , Printed Circuit Board , Flexible Board

Advantages of the HDI board

1. When the density of the PCB increases beyond the eight-layer board, the cost will be lower than the conventional complicated pressing process if manufactured by HDI board.

2. The electrical performance and signal correctness of HDI board are higher than traditional PCB.

3. HDI board has better improvement for radio frequency interference, electromagnetic wave interference, electrostatic discharge and heat conduction.

4. The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by the finer track structure can be used for components.

5. Reducing overall space requirements will result in smaller board sizes and fewer layers.

Electronic products continue to develop toward high density and high precision. The so-called "high", not only refer to improve machine performance, but also reduces the size of the machine. High-density integration (HDI) technology enables the design of end-product to be more compact while meeting higher standards of electronic performance and efficiency. Currently, many popular electronic products, such as mobile phones, medical devices, notebook computers, automotive electronics, etc., are mostly using HDI boards. With the upgrading of electronic products and the needs of the market, the development of HDI boards will be very rapid.

We're capable of manufacturing HDI PCB  up to 20 layers in various structures.

Check our HDI PCB  capabilities by below table:

Feature

Capability

Quality   Grade

Standard IPC 2

Number   of Layers

2 - 20layers

Build   Time

2days - 5weeks

Material

FR4 standard Tg 140°C,FR4 High   Tg 170°C, FR4 and Rogers combined lamination

Board   Size

Max 500*600mm

Board   Thickness

0.25mm - 5.0mm

Copper   Weight (Finished)

0.5oz - 6.0oz

Min   Tracing/Spacing

3mil/2.8mil

Solder   Mask Color

Green, White, Blue, Black, Red,   Yellow

Silkscreen   Color

White, Black, Yellow

Surface Finish

HASL - Hot Air Solder   Leveling 

Lead   Free HASL - RoHS 

ENIG -   Electroless Nickle/Immersion Gold - RoHS 

Immersion   Silver - RoHS 

Immersion   Tin - RoHS 

OSP -   Organic Solderability Preservatives - RoHS

Min   Annular Ring

4mil, 3mil - laser drill

Min   Drilling Hole Diameter

6mil, 4mil - laser drill

Other Techniques

Flex-rigid combination 

Via In   Pad 

Buried   Capacitor (only for Prototype PCB total area ≤1m²)

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Price

  • Delivery Port : shenzhen

Packaging & Delivery

  • Delivery Lead Time : 5-30days
  • Supply Ability : 80,000 square meters

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